Patent Assignment
Reel/Frame 057474/0130
Assignment of Assignor's Interest
Recorded: 2021-09-14
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor Package Including Neighboring Die Contact and Seal Ring Structures, and Methods for Forming the Same