IP Library › Assignment 057476/0078
Patent Assignment
Reel/Frame 057476/0078

Assignment of Assignor's Interest

Recorded: 2021-09-14 Pages: 8
Assignors
SHIN, HYEONJIN
Executed: 2021-09-09
LEE, MINHYUN
Executed: 2021-09-09
LEE, CHANGSEOK
Executed: 2021-09-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Interconnect Structure and Electronic Apparatus Including the Same
Application: 17/082,494 →
Publication: US 2021/0125929
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 14, 2021
From: SHIN, HYEONSUK; HONG, SEOKMO
To: UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
Reel/Frame 057476/0144 →