Patent Assignment
Reel/Frame 057482/0707
Assignment of Assignor's Interest
Recorded: 2021-09-15
Pages: 4
Assignors
WANG, KUAN-MIN
Executed: 2020-12-23
HSUEH, CHANG-JUNG
Executed: 2020-12-25
CHUANG, JUI-CHANG
Executed: 2020-12-24
LIN, WEI-HUNG
Executed: 2020-12-23
CHANG, KUO-CHIN
Executed: 2020-12-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Having Lid with Protrusion and Manufacturing Method Thereof