Patent Assignment
Reel/Frame 057495/0836
Assignment of Assignor's Interest
Recorded: 2021-09-15
Pages: 3
Assignors
WU, BINGCHIEN
Executed: 2021-01-17
WU, WEI-JEN
Executed: 2021-01-27
LO, CHUN-YEN
Executed: 2021-01-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package, Method of Bonding Workpieces and Method of Manufacturing Semiconductor Package