Patent Assignment
Reel/Frame 057501/0294
Assignment of Assignor's Interest
Recorded: 2021-09-16
Pages: 6
Assignors
SHEN, HSIANG-KU
Executed: 2019-05-21
KAO, MING-HONG
Executed: 2019-05-20
CHEN, HUI-CHI
Executed: 2019-05-22
CHEN, DIAN-HAU
Executed: 2019-05-21
CHEN, YEN-MING
Executed: 2019-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metal-Insulator-Metal Capacitive Structure and Methods of Fabricating Thereof