Patent Assignment
Reel/Frame 057506/0824
Assignment of Assignor's Interest
Recorded: 2021-09-16
Pages: 4
Assignors
LIN, CHIH-HSUAN
Executed: 2021-05-31
CHEN, HSI CHUNG
Executed: 2021-05-21
LIAO, CHIH-TENG
Executed: 2021-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method for Manufacturing Thereof