Patent Assignment
Reel/Frame 057512/0404
Assignment of Assignor's Interest
Recorded: 2021-09-17
Pages: 7
Assignors
SAWAMOTO, HAYATO
Executed: 2021-07-12
NAKAMURA, AKIHIRO
Executed: 2021-07-12
TAKASE, YUJI
Executed: 2021-07-12
NOMOTO, SHUJI
Executed: 2021-07-12
OKADE, SHOTA
Executed: 2021-07-27
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayer Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayer Printed Wiring Board
Application:
17/440,269 →
Publication:
US 2022/0155681
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.