Patent Assignment
Reel/Frame 057526/0900
Assignment of Assignor's Interest
Recorded: 2021-09-20
Pages: 2
Assignors
KURAMOCHI, CHIKA
Executed: 2021-08-19
KOMIYA, SOUICHIROU
Executed: 2021-08-19
KAMEI, JUNICHI
Executed: 2021-08-26
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Reactive Hot-Melt Adhesive Composition, and Bonded Body and Method for Producing Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.