Patent Assignment
Reel/Frame 057534/0577
Assignment of Assignor's Interest
Recorded: 2021-09-20
Pages: 7
Assignors
KIM, JINBUM
Executed: 2021-08-10
KIM, GYEOM
Executed: 2021-08-10
KIM, HYOJIN
Executed: 2021-08-10
YU, HAEJUN
Executed: 2021-08-10
LEE, SEUNGHUN
Executed: 2021-08-10
CHOI, KYUNGIN
Executed: 2021-08-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same