Patent Assignment
Reel/Frame 057564/0867
Assignment of Assignor's Interest
Recorded: 2021-09-22
Pages: 5
Assignors
CHEN, CHUN-YUAN
Executed: 2020-06-01
CHANG, CHIA-HAO
Executed: 2020-05-13
CHUANG, CHENG-CHI
Executed: 2020-05-13
LIN, YU-MING
Executed: 2020-06-01
WANG, CHIH-HAO
Executed: 2020-05-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure Having a Multi-Layer Conductive Feature and Method Making the Same