Patent Assignment
Reel/Frame 057575/0089
Assignment of Assignor's Interest
Recorded: 2021-09-23
Pages: 3
Assignors
TU, GUAN-YAO
Executed: 2021-08-29
SUNG, SU-JEN
Executed: 2021-09-14
LEE, TZE-LIANG
Executed: 2021-09-13
CHAN, HONG-WEI
Executed: 2021-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure and Method for Forming the Same