IP Library › Assignment 057578/0447
Patent Assignment
Reel/Frame 057578/0447

Assignment of Assignor's Interest

Recorded: 2021-09-23 Pages: 5
Assignors
LIM, FANG JIE
Executed: 2021-08-25
TAN, CHIN WEI
Executed: 2021-08-25
SU, JUN-LIANG
Executed: 2021-08-25
DENG, FELIX
Executed: 2021-08-25
KODUMURI, SAI KUMAR
Executed: 2021-08-30
JUPUDI, ANANTHKRISHNA
Executed: 2021-08-25
CHEN, NUNO YEN-CHU
Executed: 2021-09-14
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Low Warpage Curing Methodology by Inducing Curvature
Application: 17/410,958 →
Publication: US 2023/0061379
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2021
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 057806/0282 →