Patent Assignment
Reel/Frame 057580/0390
Assignment of Assignor's Interest
Recorded: 2021-09-23
Pages: 5
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Method of Processing Substrate Support