Patent Assignment
Reel/Frame 057583/0294
Assignment of Assignor's Interest
Recorded: 2021-09-23
Pages: 4
Assignors
DABRAL, SANJAY
Executed: 2021-09-23
ZHAI, JUN
Executed: 2021-09-23
YEH, JUNG-CHENG
Executed: 2021-09-23
HU, KUNZHONG
Executed: 2021-09-23
CAMENFORTE, RAYMUNDO
Executed: 2021-09-23
HOFFMANN, THOMAS
Executed: 2021-09-23
Assignee
APPLE INC.
ONE APPLE PARK WAY, CUPERTINO, CALIFORNIA, 95014
Covered Property
(1)
Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology