Patent Assignment
Reel/Frame 057587/0870
Assignment of Assignor's Interest
Recorded: 2021-09-24
Pages: 3
Assignors
CHIA, CHOK J.
Executed: 2017-05-18
LOW, QWAI H.
Executed: 2017-05-18
VARIOT, PATRICK
Executed: 2017-05-18
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
3d-Interconnect
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 3, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061067/0634 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →