IP Library › Assignment 061067/0634
Patent Assignment
Reel/Frame 061067/0634

Change of Name

Recorded: 2022-08-03 Pages: 6
Assignor
INVENSAS CORPORATION
Executed: 2021-10-01
Assignee
INVENSAS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (10)
Package-On-Package Assembly with Wire Bond Vias
Application: 17/512,123 →
Publication: US US20220165703A1
Advanced Device Assembly Structures And Methods
Application: 17/545,322 →
Publication: US US20220097166A1
Fine Pitch Bva Using Reconstituted Wafer With Area Array Accessible For Testing
Application: 16/734,758 →
Publication: US US20200144144A1
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
Application: 15/157,197 →
Publication: US US20160343613A1
3d-Interconnect
Application: 17/340,469 →
Publication: US US20210366857A1
Embedded Organic Interposer for High Bandwidth
Application: 17/362,712 →
Publication: US US20210327851A1
Over and Under Interconnects
Application: 16/837,948 →
Publication: US US20200321275A1
Techniques for Manufacturing Split-Cell 3D-Nand Memory Devices
Application: 17/362,557 →
Publication: US US20220005827A1
Region Shielding Within a Package of a Microelectronic Device
Application: 17/509,887 →
Publication: US US20220139846A1
3D-Interconnect with Electromagnetic Interference ("EMI") Shield and/or Antenna
Application: 17/525,559 →
Publication: US US20230154862A1
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 17, 2016
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 038622/0815 →
Assignment of Assignor's Interest Jan 6, 2020
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 051425/0318 →
Assignment of Assignor's Interest Apr 1, 2020
From: HABA, BELGACEM; MOREIN, STEPHEN; MOHAMMED, ILYAS; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 052289/0864 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest Jun 29, 2021
From: DELACRUZ, JAVIER A.; HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 056710/0072 →
Assignment of Assignor's Interest Jun 29, 2021
From: CHANG, XU; HABA, BELGACEM; KATKAR, RAJESH; FISCH, DAVID EDWARD
To: INVENSAS CORPORATION
Reel/Frame 056709/0320 →
Assignment of Assignor's Interest Sep 24, 2021
From: CHIA, CHOK J.; LOW, QWAI H.; VARIOT, PATRICK
To: INVENSAS CORPORATION
Reel/Frame 057587/0870 →
Assignment of Assignor's Interest Oct 25, 2021
From: VARIOT, PATRICK; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 057903/0409 →
Assignment of Assignor's Interest Oct 28, 2021
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 057947/0832 →
Assignment of Assignor's Interest Dec 10, 2021
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 058355/0757 →
Assignment of Assignor's Interest Feb 15, 2022
From: VARIOT, PATRICK; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 059013/0369 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name Nov 8, 2023
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 065516/0483 →
Change of Name Mar 6, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 066743/0506 →
Change of Name Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →