Patent Assignment
Reel/Frame 057653/0153
Assignment of Assignor's Interest
Recorded: 2021-09-30
Pages: 9
Assignors
NAKANO, YUKI
Executed: 2021-09-07
TERAKAWA, RYOYA
Executed: 2021-09-07
KIHARA, TAKAYUKI
Executed: 2021-09-07
OTA, HIROKI
Executed: 2021-09-07
Assignee
SUMCO CORPORATION
1-2-1 SHIBAURA, MINATO-KU, TOKYO, 105-8634, JAPAN
Covered Property
(1)
Polishing Head, Polishing Apparatus, and Method of Manufacturing Semiconductor Wafer