Patent Assignment
Reel/Frame 057657/0968
Assignment of Assignor's Interest
Recorded: 2021-09-30
Pages: 9
Assignors
ASHIZAWA, HIROAKI
Executed: 2021-09-17
NAKAMURA, HIDEO
Executed: 2021-09-17
SERIZAWA, YOSUKE
Executed: 2021-09-17
IDENO, YOSHIKAZU
Executed: 2021-09-21
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 1076325, JAPAN
Covered Property
(1)
Film Forming Method, Method for Manufacturing Semiconductor Device, Film Forming Device, and System for Manufacturing Semiconductor Device