Patent Assignment
Reel/Frame 057681/0077
Assignment of Assignor's Interest
Recorded: 2021-10-04
Pages: 12
Assignors
YANG, BO-JIUN
Executed: 2021-09-30
HSU, WEN-SUNG
Executed: 2021-09-30
CHEN, TAI-YU
Executed: 2021-09-30
LIN, SHIH-CHIN
Executed: 2021-09-30
HUNG, KUN-TING
Executed: 2021-09-30
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Device with Dummy Thermal Features on Interposer