Patent Assignment
Reel/Frame 057692/0878
Assignment of Assignor's Interest
Recorded: 2021-10-04
Pages: 7
Assignors
PARK, SANGJINE
Executed: 2021-09-06
KIM, YOUNGTAE
Executed: 2021-09-06
JEONG, JIHOON
Executed: 2021-09-06
KIM, YOUNGHOO
Executed: 2021-09-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Processing Equipment and Method of Manufacturing Semiconductor Device