Wafer processing equipment and method of manufacturing semiconductor device
A fluid supply device configured to supply a processing fluid to a wafer processing device that includes a chamber is provided. The fluid supply device includes a reservoir configured to change the processing fluid into a supercritical fluid state; a wafer protecting device comprising a body configured to prevent a wafer in the chamber of the wafer processing device from being damaged by the processing fluid in the supercritical fluid state by receiving the processing fluid in the supercritical fluid state and limiting a speed of the processing fluid; and a fluid supply line configured to provide a path for the processing fluid between the reservoir and the wafer protecting device and a path for the processing fluid between the wafer protecting device and the wafer processing device.
1. A fluid supply device configured to supply a processing fluid to a wafer processing device that includes a chamber, the fluid supply device comprising:
a reservoir configured to change the processing fluid into a supercritical fluid state;
a wafer protecting device comprising a body configured to prevent a wafer in the chamber of the wafer processing device from being damaged by the processing fluid in the supercritical fluid state by receiving the processing fluid in the supercritical fluid state and limiting a speed of the processing fluid; and
a fluid supply line configured to provide a path for the processing fluid between the reservoir and the wafer protecting device and a path for the processing fluid between the wafer protecting device and the wafer processing device,
wherein a width of the body of the wafer protecting device, in a direction perpendicular to a flow direction of the processing fluid within the wafer protecting device, is greater than a diameter of the fluid supply line, and
wherein the wafer protecting device further comprises a mesh plate having a plurality of holes.
2. The fluid supply device of claim 1 , wherein the fluid supply line is between and connected to the wafer protecting device and the wafer processing device, and the fluid supply line comprises a supply port having a linear shape.
3. The fluid supply device of claim 1 , wherein the fluid supply line comprises a plurality of bends including a bend, and
the wafer protecting device is between the bend and the wafer processing device along the fluid supply line, the bend being closest to the wafer processing device among the plurality of bends.
4. The fluid supply device of claim 1 , wherein the fluid supply line comprises a plurality of bends including a bend, and
the bend is between the wafer protecting device and the wafer processing device along the fluid supply line, the bend being closest to the wafer processing device among the plurality of bends.
5. The fluid supply device of claim 1 , wherein a volume of the body of the wafer protecting device is 20% to 200% of a volume of the wafer processing device.
6. The fluid supply device of claim 1 , wherein the body of the wafer protecting device has a cylindrical shape.
7. The fluid supply device of claim 1 , wherein the body of the wafer protecting device comprises an input surface, an output surface, and a side surface, the input surface configured to allow the processing fluid to flow therethrough into the body of the wafer protecting device, the output surface configured to allow the processing fluid to be discharged therethrough from the body of the wafer protecting device, and the side surface connecting the input surface to the output surface,
an input angle between the input surface and the flow direction of the processing fluid is greater than or equal to 90 degrees, and
an output angle between the output surface and the flow direction of the processing fluid is less than or equal to 90 degrees.
8. The fluid supply device of claim 1 , wherein the body of the wafer protecting device comprises an input surface, an output surface, and a side surface, the input surface allowing the processing fluid to flow therethrough into the body of the wafer protecting device, the output surface allowing the processing fluid to be discharged therethrough from the body of the wafer protecting device, and the side surface connecting the input surface to the output surface;
an input angle between the input surface and the flow direction of the processing fluid is greater than or equal to 90 degrees; and
an output angle between the output surface and the flow direction of the processing fluid is greater than or equal to 90 degrees.
9. The fluid supply device of claim 1 , wherein the plurality of holes have an orifice structure.
10. The fluid supply device of claim 1 , wherein a diameter of each of the plurality of holes is constant.