Patent Assignment
Reel/Frame 057702/0623
Assignment of Assignor's Interest
Recorded: 2021-10-05
Pages: 4
Assignee
NIPPON MEKTRON, LTD.
12-15, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8585, JAPAN
Covered Property
(1)
Method for Forming Through-Hole, and Substrate for Flexible Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.