Patent Assignment
Reel/Frame 057724/0739
Assignment of Assignor's Interest
Recorded: 2021-10-07
Pages: 8
Assignors
YOSHITSUGU, KOJI
Executed: 2021-08-31
NAKAMURA, KEISUKE
Executed: 2021-09-14
YAGYU, EIJI
Executed: 2021-08-31
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME,, CHIYODA-KU,, TOKYO, 1008310, JAPAN
Covered Property
(1)
Semiconductor Device Including Diamond Substrate and Semiconductor Device Manufacturing Method