Semiconductor device including diamond substrate and semiconductor device manufacturing method
It is an object of the present invention to provide a semiconductor device having high heat dissipation performance. A semiconductor device includes: a diamond substrate having a recess in an upper surface thereof; a nitride semiconductor layer disposed within the recess in the upper surface of the diamond substrate; and an electrode disposed on the nitride semiconductor layer, wherein the nitride semiconductor layer and the electrode constitute a field-effect transistor, the diamond substrate has a source via hole extending through a thickness of the diamond substrate to expose the source electrode, and the semiconductor device further includes a via metal covering an inner wall of the source via hole and a lower surface of the diamond substrate.
1 . A semiconductor device comprising:
a diamond substrate having a recess in an upper surface thereof;
a nitride semiconductor layer disposed within the recess in the upper surface of the diamond substrate; and
an electrode disposed on the nitride semiconductor layer, wherein
the nitride semiconductor layer and the electrode constitute a field-effect transistor,
the electrode includes a source electrode,
the diamond substrate has a source via hole extending through a thickness of the diamond substrate to expose the source electrode,
the semiconductor device further comprises a via metal covering an inner wall of the source via hole and a lower surface of the diamond substrate, and
the nitride semiconductor layer is a stacked structure of fine epitaxial semiconductor layers including at least one of a superlattice structure and an interfacial transition layer.
2 . The semiconductor device according to claim 1 , wherein
an entire periphery of the recess is surrounded by a protrusion of the diamond substrate in plan view, the protrusion extending from a bottom surface of the recess along a height of the recess.
3 . The semiconductor device according to claim 2 , wherein
the upper surface of the diamond substrate and an upper surface of the nitride semiconductor layer are flush with each other.
4 . The semiconductor device according to claim 1 , wherein
the diamond substrate has a higher electrical resistivity than the nitride semiconductor layer.
5 . The semiconductor device according to claim 1 , further comprising
an intervening layer disposed between the diamond substrate and the nitride semiconductor layer.
6 . The semiconductor device according to claim 1 , wherein
the source via hole is filled with diamond.
7 . The semiconductor device according to claim 1 , wherein
the field-effect transistor is a multi-finger field-effect transistor.
8 . The semiconductor device according to claim 7 , wherein
the recess comprises a plurality of recesses in the upper surface of the diamond substrate,
the electrode includes the source electrode and a drain electrode,
there is a protrusion of the diamond substrate between two adjacent recesses of the plurality of recesses, the protrusion extending from bottom surfaces of the recesses along a height of each of the recesses, and
the source electrode or the drain electrode is located on the protrusion.
9 . A semiconductor device manufacturing method comprising:
forming a nitride semiconductor layer on a semiconductor substrate;
bonding a support substrate to a first main surface of the nitride semiconductor layer, the first main surface being a main surface of the nitride semiconductor layer opposite the semiconductor substrate;
after bonding the support substrate, forming a through groove extending through thicknesses of the semiconductor substrate and the nitride semiconductor layer;
after forming the through groove, removing the semiconductor substrate;
forming a first metal on a portion of an interior of the through groove;
forming a diamond layer over a second main surface of the nitride semiconductor layer and in a region of the interior of the through groove where the first metal is not formed, the second main surface being a main surface of the nitride semiconductor layer opposite the first main surface;
after forming the diamond layer, releasing the support substrate from the first main surface of the nitride semiconductor layer;
after releasing the support substrate, forming an electrode of a field-effect transistor on the first main surface of the nitride semiconductor layer, and bringing a source electrode of the field-effect transistor into electrical contact with the first metal; and
forming a second metal in contact with the first metal and a surface of the diamond layer.
10 . The semiconductor device manufacturing method according to claim 9 , wherein
an intervening layer is formed on the second main surface of the nitride semiconductor layer between removal of the semiconductor substrate and formation of the first metal.
11 . A semiconductor device manufacturing method comprising:
preparing a free-standing diamond substrate;
forming a recess in an upper surface of the free-standing diamond substrate;
epitaxially growing a nitride semiconductor layer within the recess such that the nitride semiconductor layer completely fills the recess; and
forming an electrode layer of a field-effect transistor on an upper surface of the nitride semiconductor layer.
12 . The semiconductor device manufacturing method according to claim 11 , wherein
a source via hole extending through a thickness of the diamond substrate is formed in a region of the free-standing diamond substrate directly below a source pad of the field-effect transistor, and
a via metal is formed on an inner wall of the source via hole.
13 . The semiconductor device manufacturing method according to claim 11 , further comprising
forming an intervening layer on an inner wall of the recess between formation of the recess and epitaxial growth of the nitride semiconductor layer.
14 . The semiconductor device according to claim 1 , wherein the source via hole is completely filled with a diamond source via filler such that a lower surface of the diamond source via filler is flush with the lower surface of the diamond substrate or a lower surface of the via metal.