IP Library Assignment 057757/0199
Patent Assignment
Reel/Frame 057757/0199

Assignment of Assignor's Interest

Recorded: 2021-10-11 Pages: 4
Assignors
SEKIGUCHI, SHIGEYUKI
Executed: 2021-09-15
EGUCHI, YUJI
Executed: 2021-09-15
SEYAMA, KOHEI
Executed: 2021-09-15
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property (1)
Bonding Apparatus
Application: 17/602,279 →
Publication: US 2022/0165591
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →