Patent Assignment
Reel/Frame 057798/0011
Assignment of Assignor's Interest
Recorded: 2021-10-14
Pages: 12
Assignors
RAN, KUN
Executed: 2021-04-01
LUO, ZHENDONG
Executed: 2021-04-01
FU, LIFENG
Executed: 2021-04-01
LIN, WEICHIH
Executed: 2021-03-15
HUANG, CHANGFU
Executed: 2021-04-01
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property
(1)
Photosensitive Chip Package Structure, Camera Module, and Mobile Terminal
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 13, 2021
From: HUAWEI TECHNOLOGIES CO., LTD.
To: HONOR DEVICE CO., LTD.
Reel/Frame 055919/0344 →
Assignment of Assignor's Interest
Oct 14, 2021
From: HUAWEI TECHNOLOGIES JAPAN K.K.
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 057798/0141 →
Assignment of Assignor's Interest
Oct 14, 2021
From: YAJIMA, ATSUSHI
To: HUAWEI TECHNOLOGIES JAPAN K.K.
Reel/Frame 057814/0365 →