Patent Assignment
Reel/Frame 057798/0141
Assignment of Assignor's Interest
Recorded: 2021-10-14
Pages: 8
Assignor
HUAWEI TECHNOLOGIES JAPAN K.K.
Executed: 2021-01-01
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
ADMINISTRATIVE BUILDING, HUAWEI INDUSTRIAL BASE, BANTIAN, LONGGANG DISTRICT, SHENZHEN, CHINA
Covered Property
(1)
Photosensitive Chip Package Structure, Camera Module, and Mobile Terminal
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 13, 2021
From: HUAWEI TECHNOLOGIES CO., LTD.
To: HONOR DEVICE CO., LTD.
Reel/Frame 055919/0344 →
Assignment of Assignor's Interest
Oct 14, 2021
From: RAN, KUN; LUO, ZHENDONG; FU, LIFENG; LIN, WEICHIH
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 057798/0011 →
Assignment of Assignor's Interest
Oct 14, 2021
From: YAJIMA, ATSUSHI
To: HUAWEI TECHNOLOGIES JAPAN K.K.
Reel/Frame 057814/0365 →