Patent Assignment
Reel/Frame 057814/0365
Assignment of Assignor's Interest
Recorded: 2021-10-14
Pages: 4
Assignor
YAJIMA, ATSUSHI
Executed: 2016-12-26
Assignee
HUAWEI TECHNOLOGIES JAPAN K.K.
12TH FLOOR, WEST TOWER, OTEMACHI FIRST SQUARE, 1-5-10 OTEMACHI, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Photosensitive Chip Package Structure, Camera Module, and Mobile Terminal
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 13, 2021
From: HUAWEI TECHNOLOGIES CO., LTD.
To: HONOR DEVICE CO., LTD.
Reel/Frame 055919/0344 →
Assignment of Assignor's Interest
Oct 14, 2021
From: RAN, KUN; LUO, ZHENDONG; FU, LIFENG; LIN, WEICHIH
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 057798/0011 →
Assignment of Assignor's Interest
Oct 14, 2021
From: HUAWEI TECHNOLOGIES JAPAN K.K.
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 057798/0141 →