IP Library › Assignment 057887/0075
Patent Assignment
Reel/Frame 057887/0075

Assignment of Assignor's Interest

Recorded: 2021-10-22 Pages: 2
Assignor
MUROGA, MASATAKA
Executed: 2021-09-17
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, NAGANO-SHI, 381-2287, KOREA, REPUBLIC OF
Covered Property (1)
Wiring Substrate and Semiconductor Device Each Having First and Second via Wirings
Application: 17/508,944 →
Publication: US 2022/0130746
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party Data Previously Recorded at Reel: 057887 Frame: 0075. Assignor(S) Hereby Confirms the Assignment. May 23, 2023
From: MUROGA, MASATAKA
To: SHINKO ELECTRIC INDUSTRIES CO., LTD
Reel/Frame 063725/0791 →