Corrective Assignment to Correct the Receiving Party Data Previously Recorded at Reel: 057887 Frame: 0075. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2023-05-23 Pages: 5

Assignor

MUROGA, MASATAKA

Executed: 2021-09-17

Assignee

80,OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN

Covered Property (1)

Wiring Substrate and Semiconductor Device Each Having First and Second via Wirings

Patent: 11,823,993 →

Application: 17/508,944 →

Publication: US 2022/0130746

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.