Patent Assignment
Reel/Frame 057911/0025
Assignment of Assignor's Interest
Recorded: 2021-10-26
Pages: 4
Assignors
SHIBATA, TOMOAKI
Executed: 2021-09-08
OGAWA, TSUYOSHI
Executed: 2021-09-30
LI, XINRONG
Executed: 2021-10-10
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Producing Electronic Component Device and Laminated Film Used Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.