Patent Assignment
Reel/Frame 057920/0221
Assignment of Assignor's Interest
Recorded: 2021-10-26
Pages: 3
Assignor
CHIU, HSIH-YANG
Executed: 2020-02-17
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Method for Preparing Semiconductor Structure Having Void Between Bonded Wafers