Patent Assignment
Reel/Frame 057977/0290
Assignment of Assignor's Interest
Recorded: 2021-11-01
Pages: 16
Assignors
BHATTACHARYYA, INDRANI
Executed: 2021-10-27
BRUECKNER, JULIA ANNE DOROTHEE
Executed: 2021-10-19
CHANG, YA-HUEI
Executed: 2021-10-15
KONG, BOKYUNG
Executed: 2021-10-22
MAZUMDER, PRANTIK
Executed: 2021-10-14
YOON, JUN-RO
Executed: 2021-10-13
ZHANG, JIAN-ZHI JAY
Executed: 2021-10-19
Assignee
CORNING INCORPORATED
SP-TI-3-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Substrate Thinning Process Using Temporary Bond with Low Thickness Variation