Patent Assignment
Reel/Frame 058006/0569
Assignment of Assignor's Interest
Recorded: 2021-11-03
Pages: 4
Assignors
HOU, TE-CHIEN
Executed: 2021-10-24
CHEN, CHIH HUNG
Executed: 2021-10-14
SUEN, SHICH-CHANG
Executed: 2021-10-24
CHEN, LIANG-GUANG
Executed: 2021-10-24
LIAO, WEN-PIN
Executed: 2021-10-25
CHEN, KEI-WEI
Executed: 2021-10-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chemical-Mechanical Planarization Pad and Methods of Use