Patent Assignment
Reel/Frame 058029/0037
Assignment of Assignor's Interest
Recorded: 2021-11-05
Pages: 6
Assignors
MURATA, KOICHI
Executed: 2021-10-29
KAMATA, ISAHO
Executed: 2021-10-29
TSUCHIDA, HIDEKAZU
Executed: 2021-10-29
MIYASAKA, AKIRA
Executed: 2021-10-19
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Semiconductor Wafer Evaluation Apparatus and Semiconductor Wafer Manufacturing Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.