Patent Assignment
Reel/Frame 058060/0692
Assignment of Assignor's Interest
Recorded: 2021-11-09
Pages: 3
Assignor
NAKAMURA, KATSUMI
Executed: 2021-10-26
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Semiconductor Device