Patent Assignment
Reel/Frame 058081/0190
Assignment of Assignor's Interest
Recorded: 2021-11-11
Pages: 4
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.