IP Library Assignment 058101/0374
Patent Assignment
Reel/Frame 058101/0374

Assignment of Assignor's Interest

Recorded: 2021-11-12 Pages: 4
Assignors
SAITO, YASUYUKI
Executed: 2021-11-02
TAKAHASHI, ATSUSHI
Executed: 2021-11-01
SATAKE, REI
Executed: 2021-10-25
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polyamideimide Resin Composition and Method for Producing Polyamideimide Resin
Application: 17/610,980 →
Publication: US 2022/0228028
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →