Patent Assignment
Reel/Frame 058156/0135
Assignment of Assignor's Interest
Recorded: 2021-11-18
Pages: 3
Assignor
MORITA, MINORU
Executed: 2021-01-21
Assignee
FURUKAWA ELECTRIC CO., LTD.
6-4, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8322, JAPAN
Covered Property
(1)
Dicing Die Attach Film, and Semiconductor Package Using the Same and Method of Producing Semiconductor Package