Dicing die attach film, and semiconductor package using the same and method of producing semiconductor package

1. A dicing die attach film, comprising:

an adhesive layer; and

a temporary-adhesive layer,

wherein the adhesive layer and the temporary-adhesive layer are laminated,

wherein the adhesive layer is a film-like adhesive layer containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D);

wherein an elastic modulus of the phenoxy resin (C) at 25° C. is 500 MPa or more;

wherein, in the adhesive layer, a proportion of the phenoxy resin (C) in total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60% by mass;

wherein a peeling strength between the adhesive layer and the temporary-adhesive layer at a range of 25 to 80° C. is 0.40 N/25 mm or less; and

wherein a thermal conductivity of the adhesive layer after thermal curing is 1.0 W/m·K or more.

2. The dicing die attach film according to claim 1 , wherein when the adhesive layer is heated at a temperature elevation rate of 5° C./min from 25° C., an elastic modulus G′ before curing in a range of 25 to 80° C. is 10 kPa or more.

3. The dicing die attach film according to claim 1 , wherein when the adhesive layer is heated at a temperature elevation rate of 5° C./min from 25° C., a melt viscosity at 120° C. is in a range of 500 to 10,000 Pa·s.

4. The dicing die attach film according to claim 1 , wherein the temporary-adhesive layer is energy ray-curable.