Patent Assignment
Reel/Frame 058156/0751
Assignment of Assignor's Interest
Recorded: 2021-11-18
Pages: 6
Assignors
NEELY, MATTHEW DOUGLAS
Executed: 2021-11-04
KONRAD, JOHN
Executed: 2021-11-04
LEHRER, MACE
Executed: 2021-11-05
Assignee
TTM TECHNOLOGIES INC.
200 EAST SANDPOINTE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Property
(1)
Systems and Methods for Removing Undesired Metal Within Vias from Printed Circuit Boards
Application:
17/511,333 →
Publication:
US 2022/0053641
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →