Patent Assignment
Reel/Frame 058208/0142
Assignment of Assignor's Interest
Recorded: 2021-11-24
Pages: 8
Assignors
ISHIBASHI, NAOTO
Executed: 2021-11-22
MURATA, KOICHI
Executed: 2021-11-22
TSUCHIDA, HIDEKAZU
Executed: 2021-11-22
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC EPITAXIAL WAFER AND METHOD FOR PRODUCING SiC EPITAXIAL WAFER
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.