SiC epitaxial wafer and method for producing SiC epitaxial wafer
A SiC epitaxial wafer according to an embodiment includes: a SiC substrate; and a SiC epitaxial layer formed on a first surface of the SiC substrate. The in-plane uniformity of a density of Z 1/2 centers of the SiC epitaxial layer is 5% or less.
1. A SiC epitaxial wafer, comprising:
a SiC substrate; and
a SiC epitaxial layer formed on a first surface of the SiC substrate,
wherein in-plane uniformity of a density of Z 1/2 centers of the SiC epitaxial layer is 5% or less,
a diameter of the SiC epitaxial wafer is 149 mm or more,
the in-plane uniformity of a density of Z 1/2 centers is obtained by dividing a standard deviation at 10 or more measurements points by an average value, and
wherein the measurement points are arranged in a cross shape at a pitch of 10 mm within a range of a radius of 50 mm from a center of the SiC epitaxial wafer.
2. The SiC epitaxial wafer according to claim 1 , which has a diameter being 199 mm or more.
3. The SiC epitaxial wafer according to claim 1 , wherein a density of point defects caused by carbon interstitials contained in the SiC epitaxial layer is 1×10 11 cm −3 or less.
4. The SiC epitaxial wafer according to claim 1 , wherein densities of EH 1 centers, EH 3 centers, and RD 3 centers contained in the SiC epitaxial layer are 1×10 11 cm −3 or less.
5. The SiC epitaxial wafer according to claim 1 , wherein densities of ON 1 centers and ON 2 centers contained in the SiC epitaxial layer are 1×10 11 cm −3 or less.
6. The SiC epitaxial wafer according to claim 1 , wherein a difference between a density of Z 1/2 centers at a center of the SiC epitaxial layer and a density of Z 1/2 centers at a position 50 mm or more farther from the center of the SiC epitaxial layer is 20% or less of a value of the density of the Z 1/2 centers at the center of the SiC epitaxial layer.
7. A method for producing a SiC epitaxial wafer, comprising:
a test step; and
a main step,
wherein the test step includes:
a first film formation step of forming a SiC epitaxial layer on a first surface of a test SiC substrate;
a first measurement step of measuring in-plane uniformity of a density of Z 1/2 centers of the SiC epitaxial layer; and
a feedback step of performing first feedback for changing at least one of heating conditions in the first film formation step and temperature lowering conditions in the first film formation step on the basis of the result measured in the first measurement step,
the test step repeatedly performs the first film formation step, the first measurement step, and the feedback step a plurality of times, and
the main step includes a second film formation step of forming a SiC epitaxial layer on a first surface of a SiC substrate on the basis of the result of the test step,
the in-plane uniformity of a density of Z 1/2 centers is obtained by dividing a standard deviation at 10 or more measurements points by an average value, and
wherein the measurement points are arranged in a cross shape at a pitch of 10 mm within a range of a radius of 50 mm from a center of the SiC epitaxial wafer.
8. The method for producing a SiC epitaxial wafer according to claim 7 , wherein the test step further includes:
a first heat treatment step of subjecting the SiC epitaxial layer formed in the first film formation step to heat treatment between the first film formation step and the first measurement step, and
the feedback step further performs second feedback for changing at least one of the heating conditions in the first heat treatment step and the temperature lowering conditions in the first heat treatment step on the basis of the result measured in the first measurement step.
9. The method for producing a SiC epitaxial wafer according to claim 8 , wherein the main step further includes:
a second heat treatment step of subjecting the SiC epitaxial layer formed in the second film formation step to heat treatment on the basis of the result of the test step.
10. The method for producing a SiC epitaxial wafer according to claim 7 , wherein the first measurement step is performed using a non-destructive inspection method.
11. The method for producing a SiC epitaxial wafer according to claim 7 , wherein the main step further includes:
a second measurement step of measuring in-plane uniformity of a density of a Z 1/2 center of the SiC epitaxial layer formed in the second film formation step.
12. The method for producing a SiC epitaxial wafer according to claim 11 , wherein the second measurement step is performed using a non-destructive inspection method.