Patent Assignment
Reel/Frame 058231/0895
Assignment of Assignor's Interest
Recorded: 2021-11-29
Pages: 4
Assignors
MITSUISHI, HAJIME
Executed: 2021-11-18
SUGAYA, ISAO
Executed: 2021-11-16
KAMASHITA, ATSUSHI
Executed: 2021-11-16
OKADA, MASASHI
Executed: 2021-11-18
FUKUDA, MINORU
Executed: 2021-11-16
MAEDA, HIDEHIRO
Executed: 2021-11-16
Assignee
NIKON CORPORATION
15-3, KONAN 2-CHOME, MINATO-KU, TOKYO, 108-6290, JAPAN
Covered Property
(1)
Substrate Bonding Apparatus and Substrate Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.