Patent Assignment
Reel/Frame 058239/0272
Assignment of Assignor's Interest
Recorded: 2021-11-30
Pages: 5
Assignors
TAKADA, MITSUO
Executed: 2021-11-15
MAEDA, NANAKO
Executed: 2021-11-15
MATSUZAWA, OSAMU
Executed: 2021-11-15
ISHIKAWA, RYO
Executed: 2021-11-15
KOBAYASHI, TAKUYA
Executed: 2021-11-15
Assignee
TANAKA DENSHI KOGYO K.K.
2303-15, YOSHIDA, YOSHINOGARI-CHO, KANZAKI-GUN, SAGA, 842-0031, JAPAN
Covered Property
(1)
Palladium-Coated Copper Bonding Wire, Manufacturing Method of Palladium-Coated Copper Bonding Wire, Semiconductor Device Using the Same, and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.