Patent Assignment
Reel/Frame 075319/0511
Change of Name
Recorded: 2026-04-01
Pages: 3
Assignor
TANAKA DENSHI KOGYO K.K.
Executed: 2025-01-01
Assignee
TANAKA ELECTRONICS CO., LTD.
2303-15, YOSHIDA,, YOSHINOGARI-CHO, KANZAKI-GUN, SAGA, 842-0031, JAPAN
Covered Properties
(5)
Palladium-Coated Copper Bonding Wire and Method for Manufacturing Same
Palladium-Coated Copper Bonding Wire, Wire Bonding Structure, Semiconductor Device, and Manufacturing Method of Semiconductor Device
Gold-Coated Silver Bonding Wire and Manufacturing Method Thereof, and Semiconductor Device and Manufacturing Method Thereof
Palladium-Coated Copper Bonding Wire, Manufacturing Method of Palladium-Coated Copper Bonding Wire, Semiconductor Device Using the Same, and Manufacturing Method Thereof
Palladium-Coated Copper Bonding Wire, Manufacturing Method of Palladium-Coated Copper Bonding Wire, Wire Bonding Structure Using the Same, Semiconductor Device and Manufacturing Method Thereof
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 28, 2020
From: ANTOKU, YUKI; KAWANO, SHOTA; SAKITA, YUSUKE
To: TANAKA DENSHI KOGYO K.K.
Reel/Frame 052772/0200 →
Assignment of Assignor's Interest
May 24, 2021
From: AMANO, HIROYUKI; ANTOKU, YUKI; KUWAHARA, TAKESHI
To: TANAKA DENSHI KOGYO K.K.
Reel/Frame 056332/0551 →
Assignment of Assignor's Interest
Aug 6, 2021
From: AMANO, HIROYUKI; ANTOKU, YUKI; KUWAHARA, TAKESHI; ICHIKAWA, TSUKASA
To: TANAKA DENSHI KOGYO K.K.
Reel/Frame 057103/0662 →
Assignment of Assignor's Interest
Sep 9, 2021
From: AMANO, HIROYUKI; ANTOKU, YUKI; KUWAHARA, TAKESHI; ICHIKAWA, TSUKASA
To: TANAKA DENSHI KOGYO K.K.
Reel/Frame 057425/0025 →
Assignment of Assignor's Interest
Nov 30, 2021
From: TAKADA, MITSUO; MAEDA, NANAKO; MATSUZAWA, OSAMU; ISHIKAWA, RYO
To: TANAKA DENSHI KOGYO K.K.
Reel/Frame 058239/0272 →