Patent Assignment
Reel/Frame 052772/0200
Assignment of Assignor's Interest
Recorded: 2020-05-28
Pages: 4
Assignors
ANTOKU, YUKI
Executed: 2020-05-13
KAWANO, SHOTA
Executed: 2020-05-13
SAKITA, YUSUKE
Executed: 2020-05-13
Assignee
TANAKA DENSHI KOGYO K.K.
2303-15, YOSHIDA, YOSHINOGARI-CHO, KANZAKI-GUN, SAGA, 842-0031, JAPAN
Covered Property
(1)
Gold-Coated Silver Bonding Wire and Manufacturing Method Thereof, and Semiconductor Device and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.