Patent Assignment
Reel/Frame 057103/0662
Assignment of Assignor's Interest
Recorded: 2021-08-06
Pages: 4
Assignors
AMANO, HIROYUKI
Executed: 2021-08-06
ANTOKU, YUKI
Executed: 2021-08-06
KUWAHARA, TAKESHI
Executed: 2021-08-06
ICHIKAWA, TSUKASA
Executed: 2021-08-06
Assignee
TANAKA DENSHI KOGYO K.K.
2303-15, YOSHIDA, YOSHINOGARI-CHO, KANZAKI-GUN, SAGA, 842-0031, JAPAN
Covered Property
(1)
Palladium-Coated Copper Bonding Wire, Wire Bonding Structure, Semiconductor Device, and Manufacturing Method of Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.