Patent Assignment
Reel/Frame 056332/0551
Assignment of Assignor's Interest
Recorded: 2021-05-24
Pages: 4
Assignors
AMANO, HIROYUKI
Executed: 2021-05-17
ANTOKU, YUKI
Executed: 2021-05-17
KUWAHARA, TAKESHI
Executed: 2021-05-17
Assignee
TANAKA DENSHI KOGYO K.K.
2303-15, YOSHIDA, YOSHINOGARI-CHO, KANZAKI-GUN, SAGA, 842-0031, JAPAN
Covered Property
(1)
Palladium-Coated Copper Bonding Wire and Method for Manufacturing Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.