Patent Assignment
Reel/Frame 058296/0957
Assignment of Assignor's Interest
Recorded: 2021-12-02
Pages: 4
Assignors
ISHIDA, YASUHIRO
Executed: 2021-09-24
FURUE, KENTARO
Executed: 2021-09-24
ARAI, YOSHIKAZU
Executed: 2021-09-24
IWASAKI, MITSUHIRO
Executed: 2021-09-24
HORIBE, HIDEO
Executed: 2021-09-24
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Positive-Type Photosensitive Resin Composition and Partition Wall of Organic El Element
Application:
17/596,046 →
Publication:
US 2022/0326614
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.